Thermal Analysis

Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Several methods are commonly used - these are distinguished from one another by the property which is measured:
 
Differential thermal analysis (DTA): temperature difference
Differential scanning calorimetry (DSC): heat difference
Thermogravimetric analysis (TGA): mass
Thermomechanical analysis (TMA): dimension
Dilatometry (DIL): volume
Dynamic mechanical analysis (DMA) : mechanical stiffness & damping
Dielectric thermal analysis (DEA): dielectric permittivity & loss factor
Evolved gas analysis (EGA) : gaseous decomposition products
Thermo-optical analysis(TOA) : optical properties

Categorie

Linseis Thermal Analysis DTA-PT1600   Linseis Thermal Analysis DSC - HDSC
Temperature range -150°C up to +2400°C
Low heat capacity measuring head
Different furnaces available / -150°C up to +2400°C
Vacuum up to 10E-5mbar
Static and dynamic gas atmospheres
MS Windows 32 Bit Software  
   
Linseis THermal Analysis TMA - DMA   Thermal Diffusivity and Conductivity
     
Seebeck Coefficient - Electric Resistance Measuring System LSR-3   Standard Software
Seebeck Coefficient / Electric Resistance Measuring System

Temperature range -100°C up to 500°C, RT up to 800°C. RT up to 1100°C (different furnaces available)
 
  Standard Software Package TA-WIN and TA-DIL with Data Acquisition and Evaluation  
Standard Software   Dilatometers
All LINSEIS Thermal Analysis Instruments are controlled through
sophisticated Windows® software. 
  With a Dilatometer you can measure the expansion of a sample with a temperature variation. 
Thermal Analysis TGA - STA   Thermal Analysis MS - FTIR
     
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